HOME :PERIPHERAL DEVICE > DDR MEMORY COOLER> MEMO 4
  • Exhibition Time Table
  • China Sourcing Fair: Electronics & Components
    Asia World-Expo,Hong kong
    APRIL 12-15, 2009
    10M33
  • COMPUTEX TAIPEI 2009
    TWTC Nangang Exhibitoin Hall
    June.2-6,2009
    Floor 4, N503
  • China Sourcing Fair: Electronics & Components
    Asia World-Expo,Hong kong
    October 12-15, 2009
    10M40
  • Features
  • Application for
  • Technical Parameter
  • Installation
  • 1
  • 2
Features
  • Zero dB(A) cooling solution for DDR memory card.
  • High performance U-shape heatpipe transfer heat efficiently.
  • All copper stacked fins dissipate heat effectively.
  • Aluminum plate anodized in black with cool dragon totem, fashionable design.
Application for:
  • For Memory Card Cooling
Technical Parameter:
Overall Dimension 139.2×69.8×20mm Fin Material Copper
Heatsink Material Al Extrusion + Heatpipe + Cu Fin Nos. of Heatpipe 1 pc
Weight 84 g